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盲埋孔HDI PCB層數: 4 L
板厚: 0.8mm
外層銅厚: H OZ
內層銅厚: H OZ
最小孔徑: 0.1mm
最小線寬/線距: 3mil
表面處理: 沉金
產品用途: 銀行密匙
工藝難點: 高密度互聯+阻抗匹配
3rd Floor,Build 5,Wanxia Industrial Park,Gonghe Village,ShaJing Town,Bao'an District.ShenZhen
0755-61343332
Mr. Li 18184711806