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HDI PCB層數: 8 L
板厚: 1.2mm
外層銅厚: H OZ
內層銅厚: H OZ
最小孔徑: 0.20mm
最小線寬/線距: 3mil
表面處理: 沉金3U
產品用途: 路由器
工藝難點: 3/3 mil線寬線距
3rd Floor,Build 5,Wanxia Industrial Park,Gonghe Village,ShaJing Town,Bao'an District.ShenZhen
0755-61343332
Mr. Li 18184711806