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10層沉金通訊pcb層數: 10 L
板厚: 2.0mm
外層銅厚: 1 OZ
內層銅厚: 1 OZ
最小孔徑: 0.3mm
最小線寬/線距: 4mil
表面處理: 沉金
產品用途: 微基站主板
工藝難點: 高多層結構
3rd Floor,Build 5,Wanxia Industrial Park,Gonghe Village,ShaJing Town,Bao'an District.ShenZhen
0755-61343332
Mr. Li 18184711806